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BZT52C2V0 - SURFACE MOUNT ZENER DIODE

Key Features

  • Planar Die Construction.
  • 500mW Power Dissipation.
  • General Purpose, Medium Current.
  • Ideally Suited for Automated Assembly Processes.
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2).
  • Halogen and Antimony Free. “Green” Device (Notes 3 & 4).
  • Qualified to AEC-Q101 Standards for High Reliability BZT52C2V0 - BZT52C51.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Features  Planar Die Construction  500mW Power Dissipation  General Purpose, Medium Current  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Notes 3 & 4)  Qualified to AEC-Q101 Standards for High Reliability BZT52C2V0 - BZT52C51 SURFACE MOUNT ZENER DIODE Mechanical Data  Case: SOD123  Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208  Polarity: Cathode Band  Weight: 0.