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GDZ8V2BLP3 - ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE

Features

  • Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm).
  • Ultra-Low Profile Package (0.3mm).
  • Ideally Suited for Automated Assembly Processes.
  • Low Leakage Current, Suitable for Battery-Powered.

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Full PDF Text Transcription

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ADVANCE INFORMATION Features • Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm) • Ultra-Low Profile Package (0.3mm) • Ideally Suited for Automated Assembly Processes • Low Leakage Current, Suitable for Battery-Powered Applications • Lead Free By Design/RoHS Compliant (Note 1) • Halogen and Antimony Free "Green" Device (Notes 2 & 3) • Qualified to AEC-Q101 Standards for High Reliability GDZ8V2BLP3 ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Mechanical Data • Case: X3-DFN0603-2 • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminal Connections: Cathode Bar • Terminals: Finish − Matte Tin over Copper leadframe. Solderable per MIL-STD-202, Method 208 • Weight: 0.
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