Features
• Ultra-Small Surface Mount Package
• Planar Die Construction
• General Purpose
• Ideally Suited for Automated Assembly Processes
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
MMBZ5221BT - MMBZ5259BT
150mW SURFACE MOUNT ZENER DIODE
Mechanical Data
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.002 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Zener Current
Forward Voltage
Characteristic
(See Table on page 2)
@ IF = 10mA
Device Schematic
Symbol
⎯
VF
Value
⎯
0.9
Unit
⎯
V
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 1)
(Note 1)
Symbol
PD
RθJA
TJ, TSTG
Value
150
833
-65 to +150
Unit
mW
°C/W
°C
Notes:
1. Device mounted on FR-4 PC board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMBZ5221BT - MMBZ5259BT
Document number: DS30267 Rev. 11 - 2
1 of 4
www.diodes.com
June 2008
© Diodes Incorporated
