DDTC114ELP Key Features
- Epitaxial Planar Die Construction
- Ultra-Small Leadless Surface Mount Package
- Ideally Suited for Automated Assembly Processes
- Totally Lead-Free & Fully RoHS pliant (Notes 1 & 2)
- Halogen and Antimony Free. "Green" Device (Note 3)
- Qualified to AEC-Q101 Standards for High Reliability
- X1-DFN1006-3
- Case: X1-DFN1006-3
- Case Material: Molded Plastic, "Green" Molding pound
- Moisture Sensitivity: Level 1 per J-STD-020
