DDZ2xD Key Features
- 500mW Power Dissipation on Ceramic PCB Very Tight Tolerance on VZ Ideally Suited for Automated Assembly Processes Lead F
- 0.45 0.25
- 0° Max 3.85 2.85 1.70 1.35 0.65
- 0.10 8°
- Matte Tin annealed over Alloy 42 leadframe. Solderable per MIL-STD-202, Method 208 Marking & Type Code Information: See