RH04
Key Features
- Glass Passivated Die Construction
- Low Forward Voltage Drop
- Surge Overload Rating to 30A Peak
- Ideally Suited for Automatic Assembly
- Miniature Package Saves Space on PC Boards
- Lead Free Finish, RoHS pliant (Note
- MiniDIP L Dim Min Max G B 3.6 4.0 C 0.15 0.35 Mechanical Data B D E D ¾ 0.20 E ¾ 7.0
- Case: MiniDIP F ¾ 3.00
- Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 H
- Terminals: Finish ¾ Bright Tin. Plated Leads, Solderable J F per MIL-STD-202, Method 208
