Description
www.DataSheet4U.com DIOTEC ELECTRONICS CORP.18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958 Data Sheet N.
Features
* MECHANICAL SPECIFICATION
SDB PACKAGE SHOWN ACTUAL SIZE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE INTEGRALLY MOLDED HEAT SINK PROVI
Applications
* Through Hole for #8 Screw
BW
BL
BL AC +
UL RECOGNIZED - FILE #E124962 RoHS COMPLIANT
HEAT SINK
LM LL
LD LO
LS LS LS
MECHANICAL DATA
Case: Case: Molded epoxy with integral heat sink Epoxy carries a U/L Flammability rating of 94V-0 Terminals: Round silver plated copper pins or fast-on termin