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DIM500GDM33-TL000 Datasheet Preview

DIM500GDM33-TL000 Datasheet

Dual Switch IGBT Module

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Replaces DS6113-1
DIM500GDM33-TL000
Dual Switch IGBT Module
DS6113-2 January 2014 (LN31251)
FEATURES
Low VCE(sat) Device
10µs Short Circuit Withstand
High Thermal Cycling Capability
High Current Density Enhanced DMOS SPT
Isolated AlSiC Base with AlN Substrates
APPLICATIONS
High Reliability Inverters
Motor Controllers
Traction Drives
Choppers
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 1200V to
6500V and currents up to 2400A.
The DIM500GDM33-TL000 is a Low VCE(sat) single
switch 3300V, n-channel enhancement mode,
insulated gate bipolar transistor (IGBT) module. The
IGBT has a wide reverse bias safe operating area
(RBSOA) plus 10μs short circuit withstand. This
device is optimised for traction drives and other
applications requiring high thermal cycling capability.
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety.
KEY PARAMETERS
VCES
VCE(sat) * (typ)
IC (max)
IC(PK) (max)
3300V
2.0V
500A
1000A
* Measured at the auxiliary terminals
7(E1)
1(E1)
6(G1)
2(C)
10(C2)
9(G2)
5(C1)
3(C1)
4(E2)
8(E2)
Fig. 1 Circuit configuration
ORDERING INFORMATION
Order As:
DIM500GDM33-TL000
Note: When ordering, please use the complete part
number
Outline type code: G
(See Fig. 11 for further information)
Fig. 2 Package
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
www.dynexsemi.com
1/8




Dynex

DIM500GDM33-TL000 Datasheet Preview

DIM500GDM33-TL000 Datasheet

Dual Switch IGBT Module

No Preview Available !

DIM500GDM33-TL000
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In
extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.
Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect
device reliability.
Tcase = 25°C unless stated otherwise
Symbol
Parameter
VCES
VGES
IC
IC(PK)
Pmax
I2t
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Diode I2t value
Visol Isolation voltage per module
QPD Partial discharge per module
VGE = 0V
Test Conditions
Tcase = 115°C
1ms, Tcase = 140°C
Tcase = 25°C, Tj = 150°C
VR = 0, tp = 10ms, Tj = 125ºC
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
IEC1287, V1 = 3500V, V2 = 2600V, 50Hz RMS
Max. Units
3300 V
±20 V
500 A
1000 A
5.2 kW
80 kA2s
6000 V
10 pC
THERMAL AND MECHANICAL RATINGS
Internal insulation material:
AlN
Baseplate material:
AlSiC
Creepage distance:
33mm
Clearance:
20mm
CTI (Comparative Tracking Index):
>600
Symbol
Rth(j-c)
Rth(j-c)
Rth(c-h)
Parameter
Thermal resistance
transistor (per switch)
Thermal resistance
diode (per switch)
Thermal resistance
case to heatsink (per module)
Tj Junction temperature
Tstg Storage temperature range
Screw torque
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting M6
Electrical connections M4
Electrical connections M8
Min Typ. Max Units
- - 24 °C/kW
- - 48 °C/kW
- - 8 °C/kW
- - 150 °C
- - 150 °C
-40 - 125 °C
- - 5 Nm
- - 2 Nm
- - 10 Nm
2/8 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com


Part Number DIM500GDM33-TL000
Description Dual Switch IGBT Module
Maker Dynex
Total Page 8 Pages
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