DIM500XSM65-TS000 - Single-Switch IGBT

Features

10µs Short Circuit Withstand.
High Thermal Cycling Capability.
Soft Punch Through Silicon.
Isolated AlSiC Base With AlN Substrates.
Lead Free Construction KEY.

Dynex

Datasheet Details

Part number	DIM500XSM65-TS000
Manufacturer	Dynex
File Size	397.31 KB
Description	Single-Switch IGBT
Datasheet	DIM500XSM65-TS000 Datasheet
Additional preview pages of the DIM500XSM65-TS000 datasheet.

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Full PDF Text Transcription

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Replaces DS6173-3 Preliminary Information DIM500XSM65-TS000 Single Switch IGBT Module DS6173-4 August 2017 (LN34635) FEATURES  10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon  Isolated AlSiC Base With AlN Substrates  Lead Free Construction KEY PARAMETERS VCES VCE(sat) * (typ) IC (max) IC(PK) (max) 6500V 2.8V 500A 1000A * Measured at the auxiliary terminals APPLICATIONS  High Reliability Inverters  Motor Controllers  Traction Drives  Choppers The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 2400A.

Published: Jul 4, 2016 |