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DIM100PHM33-F000 - Half-Bridge IGBT

Key Features

  • 10µs Short Circuit Withstand.
  • High Thermal Cycling Capability.
  • Soft Punch Through Silicon.
  • Isolated AlSiC Base with AlN Substrates.
  • Lead Free Construction KEY.

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Datasheet Details

Part number DIM100PHM33-F000
Manufacturer Dynex Semiconductor
File Size 308.61 KB
Description Half-Bridge IGBT
Datasheet download datasheet DIM100PHM33-F000 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Replaces DS5764-5 DIM100PHM33-F000 Half Bridge IGBT Module DS5764-6 March 2021 (LN40739) FEATURES • 10µs Short Circuit Withstand • High Thermal Cycling Capability • Soft Punch Through Silicon • Isolated AlSiC Base with AlN Substrates • Lead Free Construction KEY PARAMETERS VCES VCE(sat) * (typ) IC (max) IC(PK) (max) 3300V 2.8V 100A 200A * Measured at the auxiliary terminals APPLICATIONS • High Reliability Inverters • Motor Controllers • Traction Auxiliaries The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 2400A.