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DIM800NSM33-F000 - Single Switch IGBT Module

Features

  • Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction KEY.

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Datasheet preview – DIM800NSM33-F000

Datasheet Details

Part number DIM800NSM33-F000
Manufacturer Dynex Semiconductor
File Size 299.76 KB
Description Single Switch IGBT Module
Datasheet download datasheet DIM800NSM33-F000 Datasheet
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www.DataSheet4U.com DIM800NSM33-F000 Single Switch IGBT Module PDS5615-4.1 January 2009(LN26570) FEATURES Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates High Thermal Cycling Capability 10µs Short Circuit Withstand Lead Free construction KEY PARAMETERS V CES V CE(sat) * (typ) IC (max) I C(PK) (max) *(measured at the auxiliary terminals) 3300V 2.8V 800A 1600A APPLICATIONS High Reliability Inverters Motor Controllers Traction Drives Choppers The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 3600A.
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