MP02HB260 Description
of part numbers see "Ordering instructions" on page 3. CURRENT RATINGS - PER ARM HB G GN PACKAGE OUTLINE 1 23 Module outline type code: See Package Details for further information.
- Part: MP02HB260
- Manufacturer: Dynex Semiconductor
- Size: 93.50 KB
Related Dynex Semiconductor Datasheets
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|---|---|
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