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EDI8L21664V - External SRAM Memory Solution

General Description

Pin Symbol A0-A14 A15A A15B WE CE1 CE2 G DQ0-15 Vcc Vss Type Input Input Input Input Input Input Input Input/Output Supply Ground Description Addresses Addresses: A15 on Bank 'A' of memory Addresses: A15 on Bank 'B' of memory Write Enable: This active LOW input allows a full 16-bit WRITE to occur.

Key Features

  • DSP Memory Solution.
  • Texas Instruments TMS320C54x 3.3V Operating Supply Voltage Access Times of 10, 12 and 15ns Single Write Control and Output Enable Lines One Chip Enable Line per Memory Bank 50% Space Savings vs. Monolithic TSOPs Upgrade Path Available in Same Footprint Multiple VCC and VSS Pins Reduced Inductance and Capacitance 74 pin BGA, JEDEC MO-151 The EDI8L21664VxxBC is a 3.3V, 2x64Kx16 SRAM constructed with two 64Kx16 die mounted on a multilayer laminate substrate. The device.

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Datasheet Details

Part number EDI8L21664V
Manufacturer EDI
File Size 90.09 KB
Description External SRAM Memory Solution
Datasheet download datasheet EDI8L21664V Datasheet

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www.DataSheet4U.com EDI8L21664V 2x64Kx16 SRAM TMS320C54x External SRAM Memory Solution Features DSP Memory Solution • Texas Instruments TMS320C54x 3.3V Operating Supply Voltage Access Times of 10, 12 and 15ns Single Write Control and Output Enable Lines One Chip Enable Line per Memory Bank 50% Space Savings vs. Monolithic TSOPs Upgrade Path Available in Same Footprint Multiple VCC and VSS Pins Reduced Inductance and Capacitance 74 pin BGA, JEDEC MO-151 The EDI8L21664VxxBC is a 3.3V, 2x64Kx16 SRAM constructed with two 64Kx16 die mounted on a multilayer laminate substrate. The device is packaged in a 74 lead, 15mm by 15mm, BGA. Operating with a 3.