• Part: GBPC1508
  • Manufacturer: EIC Semiconductor
  • Size: 94.28 KB
Download GBPC1508 Datasheet PDF
GBPC1508 page 2
Page 2

GBPC1508 Description

TH97/2478 TH09/2479 IATF 0060636 SGS TH07/1033 GBPC15005 - GBPC1510 PRV.

GBPC1508 Key Features

  • Glass passivated junction chip
  • High surge current capability
  • High current capability
  • High reliability
  • Low reverse current
  • Low forward voltage drop
  • Pb / RoHS Free
  • Case : Molded plastic with heatsink integrally mounted in the bridge encapsulation
  • Epoxy : UL94V-0 rate flame retardant
  • Terminals : plated .25" (6.35 mm). Faston