R15KP58CA Datasheet | EIC Semiconductor

FEATURES : - Glass passivated junction chip - Excellent Clamping Capability - Fast Response Time - Low Zener Impedance - Low Leakage Current - Fast Response Time : typically less than 1.0ps from 0 volt to BV, Bidirectional less than 10ns - High temperature soldering guaranteed : 265°C/10 second, 0.375",(9.5mm) lead leagth. - Pb / Ro HS Free MECHANICAL DATA - Case : Reliable low cost construction utilizing molded plastic technique - Epoxy : UL94V-0 rate flame retardant - Terminals : Plated leads solderable per MIL-STD-202, Method 208 guaranteed - Polarity : Polarity symbols marked on case - Mounting position : Any - Weight : 1.29 grams MAXIMUM RATINGS (Ta = 25°C) Rating Peak Pulse Power Dissipation (10X1000µs, see Fig.1 ) Steady State Power Dissipation Peak Forward Surge Current,1/20 Second,Ta = 25°C (JEDEC Method) (Uni-directional devices only) Operating and Storage Temperature Range TH97/2478 TH09/2479 IATF 0060636 SGS TH07/1033 TRANSIENT VOLTAGE SUPPRESSORS 5R 0.22 (5.59) 0.18 (4.57) 0.39 (10.0) 0.31 (7.87) 0.750 (19.05) MIN. 0.053 (1.35) 0.047 (1.19) 0.265 (6.73) 0.235 (5.97) Dimension in inches and (millimeter) Symbol PPK PD IFSM TJ, TSTG Value 15,000 7.0 400 - 55 to +...