WEDPNF8M721V-1210BC Datasheet | Unknown Manufacturer

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED- Features n n n Package: - 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm mercial, Industrial and Military Temperature Ranges Weight: - WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture - One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode - One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. - Any bination of sectors can be concurrently erased. Also supports full chip erase Boot Code Sector Architecture (Bottom) Embedded Erase and Program Algorithms Erase Suspend/Resume - Supports reading data from or programing data to a sector not being erased SDRAM PERFORMANCE Features n n n n n n n n Organized as 8M x 72 High Frequency = 100, 125MHz Single 3.3V ±0.3V power supply Fully Synchronous; all signals registered on positive edge of system clock cycle Internal pipelined operation; column address can be changed every clock cycle Internal banks for hiding row access/precharge Programmable Burst length 1,2,4,8 or full page 4096 refresh cycles BENEFITS n n n n n n 42% SPACE SAVINGS Reduced part count Reduced I/O count - 14% I/O Reduction Suitable for hi-reliability applications SDRAM Upgradeable to 16M x 72 density (contact factory for information) Flash upgradeable to 2M x 8 (or 1M x 16 or 512K x 32) density FLASH PERFORMANCE Features n n n n User Configurable as 1Mx8 or 512Kx16 Access Times of 100, 120, 150ns 3.3 Volt for Read and Write Operations 1,000,000 Erase/Program Cycles - This data sheet describes a product that may or may not be under development and is subject to change or cancellation without notice. September 2002 Rev. 3 White Electronic Designs Corporation - (602) 437-1520 - .whiteedc. White Electronic Designs FIG. 1 PIN CONFIGURATION TOP VIEW WEDPNF8M721V-XBX NOTES: 1. DNU = Do Not Use 2. FD16-31, BYTE2, RY/BY2 are NC in this part, and used for...