Datasheet Summary
White Electronic Designs
WEDPNF8M721V-XBX
8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED-
Features n n n Package:
- 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm mercial, Industrial and Military Temperature Ranges Weight:
- WEDPNF8M721V-XBX
- 2.5 grams typical n n n n Sector Architecture
- One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode
- One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode.
- Any bination of sectors can be concurrently erased. Also supports full chip erase Boot Code Sector Architecture (Bottom) Embedded Erase and Program Algorithms Erase Suspend/Resume
- Supports reading data...