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WEDPNF8M721V-1212BM - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

Download the WEDPNF8M721V-1212BM datasheet PDF. This datasheet also covers the WED variant, as both devices belong to the same 8mx72 synchronous dram + 8mb flash mixed module multi-chip package family and are provided as variant models within a single manufacturer datasheet.

Description

The 64MByte (512Mb) SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 134, 217, 728 bits.

Each chip is internally configured as a quad-bank DRAM with a synchronous interface.

Features

  • S n n n Package:.
  • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:.
  • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture.
  • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode.
  • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode.
  • Any combination of sectors can be concurrently erased. Also supports full chip erase Boot Code Sect.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (WED-PNF.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number WEDPNF8M721V-1212BM
Manufacturer Unknown Manufacturer
File Size 1.25 MB
Description 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
Datasheet download datasheet WEDPNF8M721V-1212BM Datasheet

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Other Datasheets by Unknown Manufacturer

Part Number Description
WEDPNF8M721V-1212BC 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1212BI 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1210BC 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1210BI 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1210BM 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. • Any combination of sectors can be concurrently erased.
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