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EOC-20 High Power Chipled

EOC-20 Description

AG Luitpoldstr.6 D-85276 Pfaffenhofen High Power Chipled - EOC - 20 Series Preliminary Data .

EOC-20 Features

* Directive characteristic Size Soldering patterns Technology Tape & Reel Grouping parameter ESD resistance voltage Assembly methods Soldering methods 110° (optional with lens 40°) 3.2 (L) x 2.8 (W) Gold plated AlInGaP, InGaN 8 mm blister tape with 2000pcs. /reel Ø 180mm or 8000 pcs. /reel Ø 330mm sor

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Datasheet Details

Part number
EOC-20
Manufacturer
Elcos AG
File Size
161.22 KB
Datasheet
EOC-20_ElcosAG.pdf
Description
High Power Chipled

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