Directive characteristic Size
Soldering patterns
Technology Tape & Reel Grouping parameter ESD resistance voltage Assembly methods Soldering methods
110° (optional with lens 40°) 3.2 (L) x 2.8 (W) Gold plated AlInGaP, InGaN 8 mm blister tape with 2000pcs. /reel Ø 180mm or 8000 pcs. /reel Ø 330mm sorted into luminous intensity groups, color groups or color coordinates up to 2 kV Suitable for all SMT assembly methods IR reflow soldering and TTW soldering.
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AG
Luitpoldstr. 6 D-85276 Pfaffenhofen
High Power Chipled - EOC - 20 Series
Preliminary Data
Features
Directive characteristic Size
Soldering patterns
Technology Tape & Reel Grouping parameter ESD resistance voltage Assembly methods Soldering methods
110° (optional with lens 40°) 3.2 (L) x 2.8 (W) Gold plated AlInGaP, InGaN 8 mm blister tape with 2000pcs./reel Ø 180mm or 8000 pcs.
EOC-20 Datasheet
