Datasheet Summary
Luitpoldstr. 6 D-85276 Pfaffenhofen
High Power Chipled
- EOC
- 20 Series
Preliminary Data
Features
Directive characteristic Size
Soldering patterns
Technology Tape & Reel Grouping parameter ESD resistance voltage Assembly methods Soldering methods
110° (optional with lens 40°) 3.2 (L) x 2.8 (W) Gold plated AlInGaP, InGaN 8 mm blister tape with 2000pcs./reel Ø 180mm or 8000 pcs./reel Ø 330mm sorted into luminous intensity groups, color groups or color coordinates up to 2 kV Suitable for all SMT assembly methods IR reflow soldering and TTW soldering
Applications
Substition of incandescent lamps Signal and indicators Marker lights Indoor and outdoor displays Backlighting Interior and...