‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and cli.

3EZ16D10

3EZ16D5L

3EZ16D5RLG

3EZ16

3EZ160

3EZ160D10

3EZ160D5

3EZ160D5L

3EZ1

3EZ10

3EZ100

3EZ100D10

3EZ100D5

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts