SMB2EZ10D5
Features
‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free ponent ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified
Mechanical Data
‧Case: DO-214AA (SMB) ‧Epoxy: UL 94V-0 rate flame retardant ‧Polarity: Laser band denotes cathode end ‧Weight: 0.095 grams (approximate)
MAXIMUM RATINGS (TA=25°C unless otherwise noted)
Parameter DC Power Dissipation at TL = 50 °C (Note1) Maximum Forward Voltage at IF = 200 m A. Junction Temperature Range Storage Temperature Range NOTE: 1. TL = Lead temperature at 3/8 " (9.5mm) from body. Symbol PD VF TJ TSTG Value 2.0 1.5
- 55 to + 175
- 55 to + 175 UNIT W V °C °C
Revision: B01
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Surface Mount Device
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