EHP-B05 Key Features
- Small package with high efficiency
- ESD protection up to 8KV
- Soldering method: SMT
- Binning Parameters: Brightness, Forward Voltage ,Wavelength and Chromaticity
- Moisture Sensitivity Level: 3
- RoHS pliant
- Matches ANSI binning
- Reliability testing conforms to IESNA LM80 Lumen maintenance test method 1 Revision