Ideal for automated placement Low power losses, high efficiency High surge current capability
Guarding for overvoltage protection Low forward voltage drop
Solder dip 260ºC, 10s / 17" (4.3 mm) from case Component in accordance to RoHS 2011/65/EU
and WEEE 2002/96/EC
Meets MSL level 1, per J-STD-020, LF maximum peak of 260º C.
