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FETek

FKBB3006 Datasheet Preview

FKBB3006 Datasheet

N-Ch MOSFETs

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FETek Technology Corp.
100% EAS Guaranteed
Green Device Available
Super Low Gate Charge
Excellent CdV/dt effect decline
Advanced high cell density Trench
technology
Description
FKBB3006
N-Ch 30V Fast Switching MOSFETs
Product Summary
BVDSS
30V
RDSON
5.5
ID
40A
PRPAK3X3 Pin Configuration
The FKBB3006 is the high cell density trenched
N-ch MOSFETs, which provide excellent RDSON
and gate charge for most of the synchronous buck
converter applications.
The FKBB3006 meet the RoHS and Green
Product requirement, 100% EAS guaranteed with
full function reliability approved.
Absolute Maximum Ratings
Symbol
VDS
VGS
ID@TC=25
ID@TC=100
ID@TA=25
ID@TA=70
IDM
EAS
IAS
PD@TC=25
PD@TA=25
TSTG
TJ
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS @ 10V1
Continuous Drain Current, VGS @ 10V1
Continuous Drain Current, VGS @ 10V1
Continuous Drain Current, VGS @ 10V1
Pulsed Drain Current2
Single Pulse Avalanche Energy3
Avalanche Current
Total Power Dissipation4
Total Power Dissipation4
Storage Temperature Range
Operating Junction Temperature Range
Thermal Data
Symbol
RθJA
RθJC
Parameter
Thermal Resistance Junction-Ambient 1
Thermal Resistance Junction-Case1
Rating
30
±20
40
20
15
12
140
115.2
48
59
2
-55 to 150
-55 to 150
Units
V
V
A
A
A
A
A
mJ
A
W
W
Typ.
---
---
Max.
62
2.1
Unit
/W
/W
Data and specifications subject to change without notice.
www.fetek.com.tw Ver : A
1




FETek

FKBB3006 Datasheet Preview

FKBB3006 Datasheet

N-Ch MOSFETs

No Preview Available !

FETek Technology Corp.
FKBB3006
N-Ch 30V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 , unless otherwise noted)
Symbol
BVDSS
RDS(ON)
Parameter
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance2
VGS(th)
Gate Threshold Voltage
IDSS Drain-Source Leakage Current
IGSS
gfs
Rg
Qg
Qgs
Qgd
Td(on)
Tr
Td(off)
Tf
Ciss
Coss
Crss
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
Total Gate Charge (4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Conditions
VGS=0V , ID=250uA
VGS=10V , ID=20A
VGS=4.5V , ID=10A
VGS=VDS , ID =250uA
VDS=24V , VGS=0V , TJ=25
VDS=24V , VGS=0V , TJ=55
VGS=±20V , VDS=0V
VDS=5V , ID=30A
VDS=0V , VGS=0V , f=1MHz
VDS=15V , VGS=4.5V , ID=15A
VDD=15V , VGS=10V , RG=3.3
ID=15A
VDS=15V , VGS=0V , f=1MHz
Diode Characteristics
Min.
30
---
---
1.2
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
Typ.
---
4.8
6.5
---
---
---
---
43
1.7
20
7.6
7.2
7.8
15
37.3
10.6
2295
267
210
Max.
---
5.5
9
2.5
1
5
±100
---
---
---
---
---
---
---
---
---
---
---
---
Unit
V
m
V
uA
nA
S
nC
ns
pF
Symbol
IS
ISM
VSD
trr
Qrr
Parameter
Continuous Source Current1,6
Pulsed Source Current2,6
Diode Forward Voltage2
Reverse Recovery Time
Reverse Recovery Charge
Conditions
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25
IF=20A , di/dt=100A/µs ,
TJ=25
Min.
---
---
---
---
---
Typ.
---
---
---
14
5
Max.
40
140
1
---
---
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width 300us , duty cycle 2%
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=48A
4.The power dissipation is limited by 150junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
Unit
A
A
V
nS
nC
Data and specifications subject to change without notice.
www.fetek.com.tw Ver : A
2


Part Number FKBB3006
Description N-Ch MOSFETs
Maker FETek
Total Page 4 Pages
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