74LVTH374 Datasheet | Fairchild Semiconductor

Features - Input and output interface capability to systems at 5V VCC - Bus-Hold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH374), also available without bushold feature (74LVT374) - Live insertion/extraction permitted - Power Up/Down high impedance provides glitch-free bus loading - Outputs source/sink - 32m A/+64m A - Functionally patible with the 74 series 374 - Latch-up performance exceeds 500m A - ESD performance: - Human-body model > 2000V - Machine model > 200V - Charged-device model > 1000V General Description The LVT374 and LVTH374 are high-speed, low-power octal D-type flip-flops featuring separate D-type inputs for each flip-flop and 3-STATE outputs for bus-oriented applications. A buffered Clock (CP) and Output Enable (OE) are mon to all flip-flops. The LVTH374 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These octal flip-flops are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT374 and LVTH374 are fabricated with an advanced Bi CMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation. Ordering Information Order Number Package Number Package Description 74LVT374WM 74LVT374SJ 74LVT374MTC 74LVTH374WM 74LVTH374SJ 74LVTH374MTC M20B M20D MTC20 M20B M20D MTC20 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC:...