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Fairchild Semiconductor Electronic Components Datasheet

FAN3100 Datasheet

Low-Side Gate Driver

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April 2008
FAN3100
Single 2A High-Speed, Low-Side Gate Driver
Features
ƒ 3A Peak Sink/Source at VDD = 12V
ƒ 4.5 to 18V Operating Range
ƒ 2.5A Sink / 1.8A Source at VDD = 6V
ƒ Dual-Logic Inputs Allow Configuration as
Non-Inverting or Inverting with Enable Function
ƒ Internal Resistors Turn Driver Off If No Inputs
ƒ 13ns Typical Rise Time and 9ns Typical Fall-Time
with 1nF Load
ƒ Choice of TTL or CMOS Input Thresholds
ƒ MillerDrive™ Technology
ƒ Typical Propagation Delay Time Under 20ns with
Input Falling or Rising
ƒ 6-Lead 2x2mm MLP or 5-Pin SOT23 Packages
ƒ Rated from –40°C to 125°C Ambient
Applications
ƒ Switch-Mode Power Supplies
ƒ High-Efficiency MOSFET Switching
ƒ Synchronous Rectifier Circuits
ƒ DC-to-DC Converters
ƒ Motor Control
Description
The FAN3100 2A gate driver is designed to drive an N-
channel enhancement-mode MOSFET in low-side
switching applications by providing high peak current
pulses during the short switching intervals. The driver is
available with either TTL (FAN3100T) or CMOS
(FAN3100C) input thresholds. Internal circuitry provides
an under-voltage lockout function by holding the output
low until the supply voltage is within the operating
range. The FAN3100 delivers fast MOSFET switching
performance, which helps maximize efficiency in high-
frequency power converter designs.
FAN3100 drivers incorporate MillerDrive™ architecture
for the final output stage. This bipolar-MOSFET
combination provides high peak current during the
Miller plateau stage of the MOSFET turn-on / turn-off
process to minimize switching loss, while providing rail-
to-rail voltage swing and reverse current capability.
The FAN3100 also offers dual inputs that can be
configured to operate in non-inverting or inverting mode
and allow implementation of an enable function. If one
or both inputs are left unconnected, internal resistors
bias the inputs such that the output is pulled low to hold
the power MOSFET off.
The FAN3100 is available in a lead-free finish 2x2mm
6-lead Molded Leadless Package (MLP), for smallest
size with excellent thermal performance, or industry-
standard 5-pin SOT23.
Functional Pin Configurations
Figure 1. 2x2mm 6-Lead MLP (Top View)
© 2007 Fairchild Semiconductor Corporation
FAN3100 • Rev. 1.0.1
Figure 2. SOT23-5 (Top View)
www.fairchildsemi.com


Fairchild Semiconductor Electronic Components Datasheet

FAN3100 Datasheet

Low-Side Gate Driver

No Preview Available !

www.DataSheet4U.com
Ordering Information
Part Number Input Threshold
Package
Packing Method
Quantity / Reel
FAN3100CMPX
CMOS
6-Lead 2x2mm MLP
FAN3100CSX
CMOS
5-Pin SOT23
FAN3100TMPX
TTL 6-Lead 2x2mm MLP
FAN3100TSX
TTL 5-Pin SOT23
All packages are lead free per JEDEC: J-STD-020B standard.
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
3000
3000
3000
3000
Package Outlines
IN+ 1
AGND 2
VDD 3
6 IN
5 PGND
4 OUT
Figure 3. 2x2mm 6-Lead MLP (Top View)
Figure 4. SOT23-5 (Top View)
Thermal Characteristics(1)
Package
ΘJL(2) ΘJT(3) ΘJA(4) ΨJB(5) ΨJT(6) Units
6-Lead 2x2mm Molded Leadless Package (MLP)
2.7 133 58 2.8 42 °C/W
SOT23-5
56 99 157 51
5 °C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3. Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and
JESD51-7, as appropriate.
5. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2.
6. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.
© 2007 Fairchild Semiconductor Corporation
FAN3100 • Rev. 1.0.1
2
www.fairchildsemi.com


Part Number FAN3100
Description Low-Side Gate Driver
Maker Fairchild Semiconductor
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FAN3100 Datasheet PDF






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