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Fairchild Semiconductor Electronic Components Datasheet

FAN3121 Datasheet

(FAN3121 / FAN3122) Low-Side Gate Driver

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September 2008
FAN3121 / FAN3122
Single 9A High-Speed, Low-Side Gate Driver
Features
ƒ Industry-Standard Pin-out with Enable Input
ƒ 4.5 to 18V Operating Range
ƒ 11.4A Peak Sink at VDD = 12V
ƒ 9.7A Sink / 7.1A Source at VOUT = 6V
ƒ Inverting Configuration (FAN3121) and
Non-Inverting Configuration (FAN3122)
ƒ Internal Resistors Turn Driver Off If No Inputs
ƒ 23ns/19ns Typical Rise/Fall Times with 10nF Load
ƒ 20ns Typical Propagation Delay Time
ƒ Choice of TTL or CMOS Input Thresholds
ƒ MillerDrive™ Technology
ƒ Available in Thermally Enhanced 3x3mm 8-Lead
MLP or 8-Lead SOIC Package (Pb-Free Finish)
ƒ Rated from –40°C to +125°C
Applications
ƒ Synchronous Rectifier Circuits
ƒ High-Efficiency MOSFET Switching
ƒ Switch-Mode Power Supplies
ƒ DC-to-DC Converters
ƒ Motor Control
Description
The FAN3121 and FAN3122 MOSFET drivers are
designed to drive N-channel enhancement MOSFETs in
low-side switching applications by providing high peak
current pulses. The drivers are available with either TTL
(FAN312xT) or CMOS (FAN312xC) input thresholds.
Internal circuitry provides an under-voltage lockout
function by holding the output low until the supply
voltage is within the operating range.
FAN312x drivers incorporate the MillerDrive™
architecture for the final output stage. This bipolar /
MOSFET combination provides the highest peak
current during the Miller plateau stage of the MOSFET
turn-on / turn-off process.
The FAN3121 and FAN3122 drivers implement an
enable function on pin 3 (EN), previously unused in the
industry-standard pin-out. The pin is internally pulled up
to VDD for active HIGH logic and can be left open for
standard operation.
The FAN3121/22 is available in a 3x3mm 8-lead thermally-
enhanced MLP package or an 8-lead SOIC package.
VDD 1
IN 2
EN 3
GND 4
8 VDD
7 OUT
6 OUT
5 GND
Figure 1. FAN3121 Pin Configuration
VDD 1
IN 2
EN 3
GND 4
8 VDD
7 OUT
6 OUT
5 GND
Figure 2. FAN3122 Pin Configuration
© 2008 Fairchild Semiconductor Corporation
FAN3121 / FAN3122 • Rev. 1.0.0
www.fairchildsemi.com


Fairchild Semiconductor Electronic Components Datasheet

FAN3121 Datasheet

(FAN3121 / FAN3122) Low-Side Gate Driver

No Preview Available !

www.DataSheet4U.com
Ordering Information
Part Number
Logic
FAN3121CMPX
FAN3121CMX Inverting Channels +
FAN3121TMPX Enable
FAN3121TMX
FAN3122CMPX
FAN3122CMX Non-Inverting Channels +
FAN3122TMPX Enable
FAN3122TMX
Input
Threshold
Package
CMOS
TTL
CMOS
TTL
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
Eco
Status
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
Packing Quantity
Method per Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package Outlines
Figure 3. 3x3mm MLP-8 (Top View)
Figure 4. SOIC-8 (Top View)
Thermal Characteristics(1)
Package
8-Lead 3x3mm Molded Leadless Package (MLP)
8-Pin Small Outline Integrated Circuit (SOIC)
ΘJL(2)
1.2
38
ΘJT(3)
64
29
ΘJA(4)
42
87
ΨJB(5)
2.8
41
ΨJT(6)
0.7
2.3
Units
°C/W
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
3. Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
4. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards
JESD51-2, JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 4. For
the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and
protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB
copper adjacent to pin 6.
6. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 4.
© 2008 Fairchild Semiconductor Corporation
FAN3121 / FAN3122 • Rev. 1.0.0
2
www.fairchildsemi.com


Part Number FAN3121
Description (FAN3121 / FAN3122) Low-Side Gate Driver
Maker Fairchild Semiconductor
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FAN3121 Datasheet PDF






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