FDZ7296
Key Features
- Occupies only 0.10 cm2 of PCB area: 1/3 the area of SO-8. Ultra-thin package: less than 0.80 mm height when mounted to PCB. High performance trench technology for extremely low RDS(ON) Optimized for low Qg and Qgd to enable fast switching and reduce CdV/dt gate coupling
