FP100 Overview
AND APPLICATIONS DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS:.
FP100 Key Features
- 14 dBm P-1dB at 12 GHz
- 9 dB Power Gain at 12 GHz
- 3.0 dB Noise Figure at 12 GHz
- DESCRIPTION AND
Datasheet Details
| Part number | FP100 |
|---|---|
| Datasheet | FP100_FiltronicCompoundSemiconductors.pdf |
| File Size | 32.67 KB |
| Manufacturer | Filtronic Compound Semiconductors |
| Description | HIGH PERFORMANCE PHEMT |
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