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Formosa MS

ZMM55C3V0 Datasheet Preview

ZMM55C3V0 Datasheet

GLASS MINI-MELF Zener Diode

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GLASS MINI-MELF Zener Diode
Formosa MSZMM55B2V0 THRU ZMM55B75
ZMM55C2V0 THRU ZMM55C100
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3~4
Rating and characteristic curves........................................................ 5~6
Pinning information...........................................................................7
Suggested solder pad layout............................................................. 7
Packing information.......................................................................... 8
Reel packing.................................................................................... 9
Suggested thermal profiles for soldering processes............................. 9
High reliability test capabilities...........................................................10
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
DS-221704
Issued Date
2008/02/10
Revised Date
2011/08/04
Revision
B
Page.
10




Formosa MS

ZMM55C3V0 Datasheet Preview

ZMM55C3V0 Datasheet

GLASS MINI-MELF Zener Diode

No Preview Available !

GLASS MINI-MELF Zener Diode
Formosa MSZMM55B2V0 THRU ZMM55B75
ZMM55C2V0 THRU ZMM55C100
500mW Surface Mount Zener
Diodes - 2.0V-100V
Features
Silicon epitaxial planar chip structure.
Zener Breakdown Voltage Range, 2.0V to 75V ex.ZMM55B2V0
Zener Breakdown Voltage Range, 2.0V to 100V ex.ZMM55C2V0
Small package size for high density applications.
Glass hermetically sealed package.
Ideally suited for automated assembly processes.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
Case : Glass Mini-MELF / SOD-80
Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : Approximated 0.03 gram
Package outline
SOD-80
.146(3.7) .019(.48)
.130(3.3) .011(.28)
SOLDERABLE
ENDS
.063(1.6)
.055(1.4)
Dimensions in inches and (millimeters)
Maximum ratings (at TA=25oC unless otherwise noted)
PARAMETER
CONDITIONS
Forward voltage
IF = 200 mA DC
Power Dissipation
Fig.1
Thermal resistance junction to ambient
Operating junction temperature range
Storage temperature range
Symbol
VF
PD
RθJA
TJ
TSTG
MIN.
-55
-65
TYP.
300
MAX. UNIT
1.50 V
500 mW
°C/W
+175 oC
+175 oC
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
DS-221704
Issued Date
2008/02/10
Revised Date
2011/08/04
Revision
B
Page.
10


Part Number ZMM55C3V0
Description GLASS MINI-MELF Zener Diode
Maker Formosa MS
Total Page 10 Pages
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