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MC13211 - 2.4 GHz Low Power Transceiver

Download the MC13211 datasheet PDF (MC1321x included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for 2.4 ghz low power transceiver.

Description

MC13211 MC13211R2 MC13212 MC13212R2 MC13213 LGA LGA Tape and Reel LGA LGA Tape and Reel LGA Intended for proprietary applications and Freescale Simple MAC (SMAC) Intended for proprietary applications and Freescale Simple MAC (SMAC) Intended for 802.15.4 Standard compliant applications and Freesca

Features

  • 802.15.4 Standard compliant on-chip transceiver/modem.
  • 2.4GHz.
  • 16 selectable channels.
  • Programmable output power Multiple power saving modes 2V to 3.4V operating voltage with on-chip voltage regulators -40°C to +85°C temperature range Low external component count Supports single 16 MHz crystal clock source operation or dual crystal operation Support for SMAC, 802.15.4 Standard, and ZigBee software 9mm x 9mm x 1mm 71-pin LGA.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MC1321x_FreescaleSemiconductor.pdf) that lists specifications for multiple related part numbers.
Other Datasheets by Freescale Semiconductor

Full PDF Text Transcription

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Freescale Semiconductor Technical Data Document Number: MC1321x Rev. 1.2 05/2007 MC1321x MC13211/212/213 ZigBee™- Compliant Platform 2.4 GHz Low Power Transceiver for the IEEE® 802.15.4 Standard plus Microcontroller 1 Package Information Case 1664-01 71-pin LGA [9x9 mm] Ordering Information Device MC13211 1 1 1 Device Marking 13211 13212 13213 Package LGA LGA LGA MC13212 MC13213 See Table 1 for more details. 1 Introduction Contents 1 2 3 4 5 6 7 8 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1 MC1321x Pin Assignment and Connections 8 MC1321x Serial Peripheral Interface (SPI) . 14 802.15.4 Standard Modem . . . . . . . . . . . . . . 16 MCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 System Electrical Specification . . . . . . . . .
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