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Freescale Semiconductor Electronic Components Datasheet

MC33662 Datasheet

LIN Physical Layer

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Freescale Semiconductor
Advance Information
Document Number: MC33662
Rev. 7.0, 1/2014
LIN 2.1 / SAEJ2602-2, LIN
Physical Layer
33662
The Local Interconnect Network (LIN) is a serial communication
protocol, designed to support automotive networks in conjunction with
a Controller Area Network (CAN). As the lowest level of a hierarchical
network, LIN enables cost-effective communication with sensors and
actuators when all the features of CAN are not required.
The three 33662 versions are designed to operate at different
maximum baud rates. The 33662LEF and 33662BLEF, and the
33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and
the 33662JEF and 33662BJEF, a slow baud rate (10 kbps). They
integrate a fast baud rate (above 100 kbps), as reported by the RXD pin
for test and programming modes. They provide excellent EMC
(Electromagnetic Compatibility) and Radiated Emission performance,
ESD (Electrostatic Discharge) robustness, and safe behavior, in the
event of a LIN bus short-to-ground, or a LIN bus leakage during low-
power mode. This device is powered by SMARTMOS technology.
LINCELL
Features
• Operational from a VSUP of 7.0 to 18 V DC, functional up to 27 V DC,
and handles 40 V during Load Dump
• Compatible with LIN Protocol Specification 1.3, 2.0, 2.1, and
SAEJ2602-2
• Active bus wave shaping, offering excellent radiated emission
performance
• Sustains up to 15.0 kV minimum ESD IEC61000-4-2 on the LIN Bus,
20 kV on the WAKE pin, and 25 kV on the VSUP pin
• Very high immunity against electromagnetic interference
• Low standby current in Sleep mode
• Overtemperature protection
• Local and remote Wake-up capability reported by the RXD pin
• Fast baud rate selection reported by RXD pin
• 5.0 V and 3.3 V compatible digital inputs without any required
external components
EF SUFFIX (PB-FREE)
98ASB42564B
8-PIN SOICN
Applications
• Automotive Market:
• Body electronics (BCM, gateway, roof, door,
lighting, HVAC)
• Powertrain (EMS, start & stop), BMS
• Safety & Chassis (TPMS, seat belt)
VBAT
CAN SBC
or
Regulator
12 V
5.0 V
or 3.3 V
VDD
MCU
33662
VSUP
WAKE
EN
RXD
INH
TXD
LIN
GND
LIN Interface
Figure 1. 33662 Master LIN Bus Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2011-2014. All rights reserved.


Freescale Semiconductor Electronic Components Datasheet

MC33662 Datasheet

LIN Physical Layer

No Preview Available !

DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Variations
Freescale Part No.
(Add an R2 suffix for Tape and Reel
orders)
MC33662LEF (1)
MC33662BLEF
MC33662SEF (1)
MC33662BSEF
MC33662JEF (1)
MC33662BJEF
Maximum Baud Rate
20 kbps
20 kbps with restricted limits for
transmitter and receiver symmetry
10 kbps
Temperature Range (TA)
-40 to 125 °C
Package
8 SOICN
Notes
1. In Sleep mode, the total module current consumption may be higher than expected if the external pull-up resistor on the RxD pin
is implemented. There may be an unexpected glitch on RxD as INH goes low.
33662
2
Analog Integrated Circuit Device Data
Freescale Semiconductor


Part Number MC33662
Description LIN Physical Layer
Maker Freescale Semiconductor
Total Page 30 Pages
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