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MPX2301DT1 Datasheet High Volume Pressure Sensor

Manufacturer: Freescale Semiconductor (now NXP Semiconductors)

Overview: www.DataSheet4U.com Freescale Semiconductor Technical Data MPX2300DT1 Rev. 6, 10/2004 High Volume Pressure Sensor For Disposable Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub--module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor’s unique sensor die with its piezoresistive technology, along with the added feature of on--chip, thin--film temperature compensation and calibration. NOTE: Freescale Semiconductor is also offering the Chip Pak package in application--specific configurations, which will have an “SPX” prefix, followed by a four--digit number, unique to the specific customer.

Download the MPX2301DT1 datasheet PDF. This datasheet also includes the MPX2300DT1 variant, as both parts are published together in a single manufacturer document.

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Key Features

  • Low Cost.
  • Integrated Temperature Compensation and Calibration.
  • Ratiometric to Supply Voltage.
  • Polysulfone Case Material (Medical, Class V Approved).
  • Provided in Easy--to--Use Tape and Reel.

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More Datasheets from Freescale Semiconductor (now NXP Semiconductors)

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MPX2300DT1 Compensated Pressure Sensor
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MPX2100A 100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
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