Description
1.1 Overall Block Diagram
The block diagram of the device is shown in Figure 1-1. This diagram covers all the main blocks mentioned above and their main signal interactions.Power management controls and bus control signals are not shown in this block diagram for clarity.1.2
Multi-Chip Interface
The device contains four devices using the best process technology for each.
Microcontroller (MCU)
RF transmitter device (RFX)
Pressure sensing device (P-CHIP)
Features
- Pressure sensor with signal interface to ADC10 Temperature sensor with signal interface to ADC10 Z- and X-axis accelerometers with signal interface to ADC10 Voltage reference measured by ADC10 4-channel, 10-bit analog-to-digital converter 8-bit MCU.
- S08 Core with SIM, interrupt and debug/monitor.
- 512 RAM.
- 8K FLASH (in addition to 8K providing factory firmware and trim data).
- 32-byte, low power, parame.