* Part III, “Electrical and Thermal Characteristics” Part IV, “Thermal Characteristics” Part V, “Power Considerations” Part VI, “Bus Signal Timing” Part VII, “IEEE 1149.1 Electrical Specifications” Part VIII, “CPM Electrical Characteristics” Part IX, “Mechanical Data and Ordering Information” Part X,
XPC850D
Freescale Semiconductor
811.80 KB
1 chip integrated microprocessor.
Advance Information MPC850EC/D Rev. 0.2, 04/2002 MPC850 (Rev. A/B/C) Communications Controller Hardware Specifications This document contains detailed.
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