FZ1150
Features
- Toal power dissipation:max,1.0W
- Low leakage current
- Moisture sensitivity: level 1, per J-STD-020
- Solder dip 260 °C, 10 s
- Low profile， typical thickness 1.0mm
- For use in stabilizing and clipping circuits with high power rating e SGA (SOD‐123FL)
Maximum Ratings and Thermal Characteristics
(TA = 25 °C unless otherwise noted)
Parameter
Symbol
Value
Unit
Zener current
See Next Table
Power dissipation at Tamb=75℃
Maximum instantaneous forward voltage at 200m A
Thermal resistance junction to ambient air
Operating junction and storage temperature range
Ptot VF Rthja TJ, TSTG
1 1.2 100 -55 to +150
W V ℃/W ℃
Note:1),The thermal resistance from junction to ambient,case or mount,mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Part Number
F1N4738 F1N4739 F1N4740 F1N4741 F1N4742 F1N4743 F1N4744
Zener voltage
Test Dynamic Knee Knee Reverse current impedance current impedance current
VZ /V
IZT...
