FZ1200 Datasheet | Good-Ark Semiconductor

Features - Toal power dissipation:max,1.0W - Low leakage current - Moisture sensitivity: level 1, per J-STD-020 - Solder dip 260 °C, 10 s - Low profile， typical thickness 1.0mm - For use in stabilizing and clipping circuits with high power rating e SGA (SOD‐123FL) Maximum Ratings and Thermal Characteristics (TA = 25 °C unless otherwise noted) Parameter Symbol Value Unit Zener current See Next Table Power dissipation at Tamb=75℃ Maximum instantaneous forward voltage at 200m A Thermal resistance junction to ambient air Operating junction and storage temperature range Ptot VF Rthja TJ, TSTG 1 1.2 100 -55 to +150 W V ℃/W ℃ Note:1),The thermal resistance from junction to ambient,case or mount,mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB Electrical Characteristics (TA = 25 °C unless otherwise noted) Part Number F1N4738 F1N4739 F1N4740 F1N4741 F1N4742 F1N4743 F1N4744 Zener voltage Test Dynamic Knee Knee Reverse current impedance current impedance current VZ /V IZT ZZT IZK ZZK IR(Max) Vz(MIN) Vz(MAX) m A Ω m A Ω µAdc 7.79 8.61 31 4.5 0.5 700 9.56 28 0.5 700 9.5 10.5 25 7 0.25 700...