Download GSGP0260SD Datasheet PDF
GSGP0260SD page 2
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GSGP0260SD Key Features

  • Low forward voltage drop
  • Low leakage current
  • Moisture sensitivity: level 1, per J-STD-020
  • Solder dip 260 °C, 10 s
  • Low profile, typical thickness 1.0mm

GSGP0260SD Description

Features Low forward voltage drop Low leakage current Moisture sensitivity: level 1, per J-STD-020 Solder dip 260 °C, 10 s Low profile, typical thickness 1.0mm GSGP0260SD Surface Mount Schottky Rectifier Reverse Voltage 60V Forward Current 2A Package: eSGP (SOD‐323F) Applications For use in fast swiching in RF module, lighting, cell phone, portable devices, power supplie and other consumer applications.