L1N4757
Key Features
- Toal power dissipation: max1.0W
- Low leakage current
- Moisture sensitivity: level 1, per J-STD-020
- Solder dip 260 °C, 10 s
- Low profile， typical thickness 1.0mm
- For use in stabilizing and clipping circuits with high power rating
- Zener voltage tolerance is ±5% Package: eSGB(SMAF)
