S0603F1.5 Datasheet | Good-Ark Semiconductor

Description - Fast acting for excessive current - patible with reflow and wave solder - Rugged ceramic and glass construction - Excellent environmental performance - Ro HS pliant, Lead Free & Halogen Free material Applications - Telemunication: PDA / DSL/ Cell Phones - puters: LCD Panels / Printers/ Laptops/ Servers - Consumer Electronics: DVD players/ MP3 and MP4 Players Sn PLATING CERAMIC SUBSTRATE OVERCOAT FUSE ELEMENT Ag / Ni PLATING Case: 0603 Environmental Data - Life Test: MIL-STD-202, Method 108A - Humidity Bias: MIL-STD-202, Method 103 - Moisture Resistance Test: MIL-STD-202, Method 106G - Thermal Shock: MIL-STD-202, Method 107G - Terminal Strength: AEC-Q200-006 - Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min) - Vibration: MIL-STD-202, Method 204D - Mechanical Shock: MIL-STD-202, Method 213B - Solderability: MIL-STD-202 Method 208H - Resistance to Solder Heat: MIL-STD-202, Method 210A Electrical Characteristics Ampere Rating 250m A-6A 250m A-6A % of Amp Rating 100% Opening Time 4 Hours Minimum 250% 5 Seconds Maximum 1/3 S0603F Series Fast Acting Chip Fuse Electrical Specifications Product Code S0603F250 S0603F375 S0603F500 S0603F750 S0603F1 S0603F1.25 S0603F1.5 S0603F1.75 S0603F2 S0603F2.5 S0603F3 S0603F3.5 S0603F4 S0603F5 S0603F6 Current...