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GS81302R08GE Datasheet Preview

GS81302R08GE Datasheet

144Mb SigmaDDR-II Burst of 4 SRAM

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GS81302R08/09/18/36E-375/350/333/300/250
165-Bump BGA
Commercial Temp
Industrial Temp
144Mb SigmaDDRTM-II
Burst of 4 SRAM
375 MHz–250 MHz
1.8 V VDD
1.8 V and 1.5 V I/O
Features
• Simultaneous Read and Write SigmaDDR™ Interface
• Common I/O bus
• JEDEC-standard pinout and package
• Double Data Rate interface
• Byte Write (x36 and x18) and Nybble Write (x8) function
• Burst of 4 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with present 9Mb, 18Mb, 36Mb and 72Mb
devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
SigmaDDRFamily Overview
The GS81302R08/09/18/36E are built in compliance with the
SigmaDDR-II SRAM pinout standard for Common I/O
synchronous SRAMs. They are 150,994,944-bit (144Mb)
SRAMs. The GS81302R08/09/18/36E SigmaDDR-II SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Clocking and Addressing Schemes
The GS81302R08/09/18/36E SigmaDDR-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
Each internal read and write operation in a SigmaDDR-II B4
RAM is four times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed.
When a new address is loaded into a x18 or x36 version of the
part, A0 and A1 are used to initialize the pointers that control
the data multiplexer / de-multiplexer so the RAM can perform
"critical word first" operations. From an external address point
of view, regardless of the starting point, the data transfers
always follow the same linear sequence {00, 01, 10, 11} or
{01, 10, 11, 00} or {10, 11, 00, 01} or {11, 00, 01, 10} (where
the digits shown represent A1, A0).
Unlike the x18 and x36 versions, the input and output data
multiplexers of the x8 and x9 versions are not preset by
address inputs and therefore do not allow "critical word first"
operations. The address fields of the x8 and x9 SigmaDDR-II
B4 RAMs are two address pins less than the advertised index
depth (e.g., the 16M x 8 has a 4M addressable index, and A0
and A1 are not accessible address pins).
Parameter Synopsis
tKHKH
tKHQV
-375
2.66 ns
0.45 ns
-350
2.86 ns
0.45 ns
-333
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
-250
4.0 ns
0.45 ns
Rev: 1.03b 12/2011
1/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology




GSI Technology

GS81302R08GE Datasheet Preview

GS81302R08GE Datasheet

144Mb SigmaDDR-II Burst of 4 SRAM

No Preview Available !

GS81302R08/09/18/36E-375/350/333/300/250
4M x 36 SigmaDDR-II SRAM—Top View
1 2 3 4 5 6 7 8 9 10 11
A CQ SA SA R/W BW2 K BW1 LD SA SA CQ
B
NC DQ27 DQ18 SA BW3
K
BW0
SA
NC/SA
(288Mb)
NC
DQ8
C NC NC DQ28 VSS SA SA0 SA1 VSS NC DQ17 DQ7
D NC DQ29 DQ19 VSS VSS VSS VSS VSS NC NC DQ16
E
NC
NC
DQ20
VDDQ
VSS
VSS
VSS VDDQ NC DQ15 DQ6
F
NC
DQ30 DQ21
VDDQ
VDD
VSS
VDD VDDQ NC
NC DQ5
G
NC
DQ31 DQ22
VDDQ
VDD
VSS
VDD VDDQ NC
NC DQ14
H
Doff
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
DQ32
VDDQ
VDD
VSS
VDD VDDQ NC DQ13 DQ4
K
NC
NC
DQ23
VDDQ
VDD
VSS
VDD VDDQ NC DQ12 DQ3
L
NC
DQ33
DQ24
VDDQ
VSS
VSS
VSS VDDQ NC
NC DQ2
M
NC
NC DQ34 VSS VSS VSS VSS
VSS
NC
DQ11
DQ1
N
NC DQ35 DQ25 VSS
SA
SA
SA
VSS NC
NC DQ10
P NC NC DQ26 SA SA C SA SA NC DQ9 DQ0
R
TDO TCK
SA
SA
SA
C
SA SA SA TMS TDI
11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch
Notes:
1. BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17; BW2 controls writes to DQ18:DQ26; BW3 controls writes to
DQ27:DQ35.
2. B9 is the expansion address.
Rev: 1.03b 12/2011
2/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology


Part Number GS81302R08GE
Description 144Mb SigmaDDR-II Burst of 4 SRAM
Maker GSI Technology
Total Page 30 Pages
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