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GS8170DD18C-330 - SigmaRAM SRAM

Download the GS8170DD18C-330 datasheet PDF. This datasheet also covers the GS8170DD18C variant, as both devices belong to the same sigmaram sram family and are provided as variant models within a single manufacturer datasheet.

General Description

Because SigmaRAMs are synchronous devices, address and read/write control inputs are captured on the rising edge of the input clock.

Write cycles are internally self-timed and initiated by the rising edge of the clock input.

Key Features

  • Double Data Rate Read and Write mode.
  • JEDEC-standard SigmaRAM™ pinout and package.
  • 1.8 V +150/.
  • 100 mV core power supply.
  • 1.5 V or 1.8 V I/O supply.
  • Pipelined read operation.
  • Fully coherent read and write pipelines.
  • Echo Clock outputs track data output drivers.
  • ZQ mode pin for user-selectable output drive strength.
  • 2 user-programmable chip enable inputs for easy depth expansion.
  • IEEE 1149.1 JTAG-com.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (GS8170DD18C_GSITechnology.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number GS8170DD18C-330
Manufacturer GSI Technology
File Size 889.66 KB
Description SigmaRAM SRAM
Datasheet download datasheet GS8170DD18C-330 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Preliminary GS8170DD18/36C-333/300/250 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x2Lp Double Data Rate SigmaRAM™ SRAM 250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Double Data Rate Read and Write mode • JEDEC-standard SigmaRAM™ pinout and package • 1.8 V +150/–100 mV core power supply • 1.5 V or 1.8 V I/O supply • Pipelined read operation • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • ZQ mode pin for user-selectable output drive strength • 2 user-programmable chip enable inputs for easy depth expansion • IEEE 1149.1 JTAG-compatible Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices - 333 3.0 ns 1.