The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
Preliminary GS8170DD18/36C-333/300/250
209-Bump BGA Commercial Temp Industrial Temp
18Mb Σ1x2Lp Double Data Rate SigmaRAM™ SRAM
250 MHz–333 MHz 1.8 V VDD 1.8 V and 1.5 V I/O
Features
• Double Data Rate Read and Write mode • JEDEC-standard SigmaRAM™ pinout and package • 1.8 V +150/–100 mV core power supply • 1.5 V or 1.8 V I/O supply • Pipelined read operation • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • ZQ mode pin for user-selectable output drive strength • 2 user-programmable chip enable inputs for easy depth expansion • IEEE 1149.1 JTAG-compatible Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices - 333 3.0 ns 1.