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GS8170LW36/72C-333/300/250/200
209-Bump BGA Commercial Temp Industrial Temp Features
• Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package • 1.8 V +150/–100 mV core power supply • 1.8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM™
Functional Description
200 MHz–333 MHz 1.8 V VDD 1.