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GS8256436GD-200 Datasheet Preview

GS8256436GD-200 Datasheet

288Mb DCD Sync Burst SRAM

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GS8256418/36(GB/GD)-400/333/250/200
119- & 165-Bump BGA
Commercial Temp
Industrial Temp
16M x 18, 8M x 36
288Mb DCD Sync Burst SRAMs
400 MHz200 MHz
2.5 V or 3.3 V VDD
2.5 V or 3.3 V I/O
Features
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 2.5 V +10%/–10% core power supply
• 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• ZZ pin for automatic power-down
• RoHS-compliant 119-bump and 165-bump BGA packages
Functional Description
Applications
The GS8256418/36 is a 301,989,888-bit high performance
synchronous SRAM with a 2-bit burst address counter. Although
of a type originally developed for Level 2 Cache applications
supporting high performance CPUs, the device now finds
application in synchronous SRAM applications, ranging from
DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
DCD Pipelined Reads
The GS8256418/36 is a DCD (Dual Cycle Deselect) pipelined
synchronous SRAM. DCD SRAMs pipeline disable commands to
the same degree as read commands. DCD RAMs hold the deselect
command for one full cycle and then begin turning off their
outputs just after the second rising edge of clock.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
FLXDrive™
The ZQ pin allows selection between high drive strength (ZQ low)
for multi-drop bus applications and normal drive strength (ZQ
floating or high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Core and Interface Voltages
The GS8256418/36 operates on a 2.5 V or 3.3 V power supply.
All input are 3.3 V and 2.5 V compatible. Separate output power
Parameter Synopsis
Pipeline
3-1-1-1
Flow Through
2-1-1-1
tKQ
tCycle
Curr (x18)
Curr (x36)
tKQ
tCycle
Curr (x18)
Curr (x36)
-400 -333 -250 -200 Unit
2.5
2.5
2.5
3.0
ns
2.5
3.0
4.0
5.0
ns
730 650 540 520 mA
820 720 590 470 mA
4.0
4.5
5.5
6.5
ns
4.0
4.5
5.5
6.5
ns
520 500 440 410 mA
540 550 500 470 mA
Rev: 1.03 5/2017
1/34
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2015, GSI Technology




GSI Technology

GS8256436GD-200 Datasheet Preview

GS8256436GD-200 Datasheet

288Mb DCD Sync Burst SRAM

No Preview Available !

GS8256418/36(GB/GD)-400/333/250/200
119-Bump BGA—x36 Common I/O—Top View
1
2
3
4
5
6
7
A
VDDQ
A
A
ADSP
A
A
VDDQ
A
B
A
A
A
ADSC
A
A
NC
B
C
A
A
A
VDD
A
A
NC
C
D
DQC
DQPC
VSS
ZQ
VSS
DQPB
DQB
D
E
DQC
DQC
VSS
E1
VSS
DQB
DQB
E
F
VDDQ
DQC
VSS
G
VSS
DQB
VDDQ
F
G
DQC2
DQC
BC
ADV
BB
DQB
DQB
G
H
DQC
DQC
VSS
GW
VSS
DQB
DQB
H
J
VDDQ
VDD
NC
VDD
NC
VDD
VDDQ
J
K
DQD
DQD
VSS
CK
VSS
DQA
DQA
K
L
DQD
DQD
BD
NU
BA
DQA
DQA
L
M
VDDQ
DQD
VSS
BW
VSS
DQA
VDDQ
M
N
DQD
DQD
VSS
A1
VSS
DQA
DQA
N
P
DQD
DQPD
VSS
A0
VSS
DQPA
DQA
P
R
NC
A
LBO
VDD
FT
A
NC
R
T
NC
A
A
A
A
A
ZZ
T
U
VDDQ
TMS
TDI
TCK
TDO
NC
VDDQ
U
7 x 17 Bump BGA—14 x 22 mm2 Body—1.27 mm Bump Pitch
Rev: 1.03 5/2017
2/34
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2015, GSI Technology



Part Number GS8256436GD-200
Description 288Mb DCD Sync Burst SRAM
Maker GSI Technology
Total Page 3 Pages
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