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GS8672T38BE Datasheet Preview

GS8672T38BE Datasheet

72Mb SigmaDDR-II+ Burst of 2 ECCRAM

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GS8672T20/38BE-633/550/500/450/400
165-Bump BGA
Commercial Temp
Industrial Temp
72Mb SigmaDDR-II+TM
Burst of 2 ECCRAMTM
633 MHz–400 MHz
1.8 V VDD
1.5 V I/O
Features
• 2.5 Clock Latency
• On-Chip ECC with virtually zero SER
• Simultaneous Read and Write SigmaDDR™ Interface
• Common I/O bus
• JEDEC-standard package
• Double Data Rate interface
• Byte Write capability
• Burst of 2 Read and Write
• On-Die Termination (ODT) on Data (DQ), Byte Write (BW),
and Clock (K, K) outputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with 36Mb and 144Mb devices
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
SigmaDDRECCRAM Overview
The GS8672T20/38BE SigmaDDR-II+ ECCRAMs are built in
compliance with the SigmaDDR-II+ SRAM pinout standard
for Common I/O synchronous SRAMs. They are
75,497,472-bit (72Mb) SRAMs. The GS8672T20/38BE
SigmaDDR SRAMs are just one element in a family of low
power, low voltage HSTL I/O SRAMs designed to operate at
the speeds needed to implement economical high performance
networking systems.
Clocking and Addressing Schemes
The GS8672T20/38BE SigmaDDR-II+ SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Each internal read and write operation in a SigmaDDR-II+ B2
ECCRAM is two times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed. Therefore the address
field of a SigmaDDR-II+ B2 ECCRAM is always one address
pin less than the advertised index depth (e.g., the 4M x 18 has
an 2M addressable index).
On-Chip Error Correction Code
GSI's ECCRAMs implement an ECC algorithm that detects
and corrects all single-bit memory errors, including those
induced by Soft Error Rate (SER) events such as cosmic rays,
alpha particles etc. The resulting SER of these devices is
anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude
improvement over comparable SRAMs with no On-Chip ECC,
which typically have an SER of 200 FITs/Mb or more. SER
quoted above is based on reading taken at sea level.
However, the On-Chip Error Correction (ECC) will be
disabled if a “Half Write” operation is initiated. See the Byte
Write Contol section for further information.
tKHKH
tKHQV
-633
1.57 ns
0.45 ns
Parameter Synopsis
-550
1.81 ns
0.45 ns
-500
2.0 ns
0.45 ns
-450
2.2 ns
0.45 ns
-400
2.5 ns
0.45 ns
Rev: 1.02a 6/2013
1/27
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology




GSI Technology

GS8672T38BE Datasheet Preview

GS8672T38BE Datasheet

72Mb SigmaDDR-II+ Burst of 2 ECCRAM

No Preview Available !

GS8672T20/38BE-633/550/500/450/400
2M x 36 SigmaDDR-II+ SRAM—Top View
1 2 3 4 5 6 7 8 9 10 11
A
CQ
NF
(144Mb)
SA
R/W BW2
K
BW1 LD
SA
SA
CQ
B NC DQ27 DQ18 SA BW3 K BW0 SA NC NC DQ8
C NC NC DQ28 VSS SA NF SA VSS NC DQ17 DQ7
D NC DQ29 DQ19 VSS VSS VSS VSS VSS NC NC DQ16
E
NC
NC
DQ20
VDDQ
VSS
VSS
VSS VDDQ NC DQ15 DQ6
F
NC
DQ30 DQ21
VDDQ
VDD
VSS
VDD VDDQ NC
NC DQ5
G
NC
DQ31 DQ22
VDDQ
VDD
VSS
VDD VDDQ NC
NC DQ14
H
Doff
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
VDDQ
VREF
ZQ
J
NC
NC
DQ32
VDDQ
VDD
VSS
VDD VDDQ NC DQ13 DQ4
K
NC
NC
DQ23
VDDQ
VDD
VSS
VDD VDDQ NC DQ12 DQ3
L
NC
DQ33
DQ24
VDDQ
VSS
VSS
VSS VDDQ NC
NC DQ2
M
NC
NC DQ34 VSS VSS VSS VSS
VSS
NC
DQ11
DQ1
N
NC DQ35 DQ25 VSS
SA
SA
SA
VSS NC
NC DQ10
P NC NC DQ26 SA SA QVLD SA SA NC DQ9 DQ0
R
TDO TCK
SA
SA
SA ODT SA
SA
SA TMS TDI
11 x 15 Bump BGA—13 x 15 mm2 Body—1 mm Bump Pitch
Note:
BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17; BW2 controls writes to DQ18:DQ26; BW3 controls writes to DQ27:DQ35
Rev: 1.02a 6/2013
2/27
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2011, GSI Technology


Part Number GS8672T38BE
Description 72Mb SigmaDDR-II+ Burst of 2 ECCRAM
Maker GSI Technology
Total Page 27 Pages
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