ES3F
FEATURES
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- For surface mount applications
- Low profile package
- Built-in strain relief
- Ideal for automated placement
- Easy pick and place
- Superfast recovery time for high efficiency
- Glass passivated chip junction
- High temperature soldering: 250°C/10 seconds at terminals
0.126 (3.20) 0.114 (2.90)
0.245 (6.22) 0.220 (5.59)
0.280 (7.11) 0.260 (6.60) 0.012 (0.305) 0.006 (0.152)
0.103 (2.62) 0.079 (2.06)
MECHANICAL DATA
0.008 (0.203) MAX. 0.320 (8.13) 0.305 (7.75)
0.060 (1.52) 0.030 (0.76)
Dimensions in inches and (millimeters)
Case: JEDEC DO-214AB molded plastic body over passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.007 ounces, 0.21 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
ES3G
UNITS
Device marking code Maximum...
