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GPR25L642B Datasheet Preview

GPR25L642B Datasheet

CMOS Serial Flash

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GPR25L642B
64M-Bit [x 1 / x 2] COMS Serial Flash
APR. 26, 2011
Version 1.2
GENERALPLUS TECHNOLOGY INC. reserves the right to change this documentation without prior notice. Information provided by GENERALPLUS TECHNOLOGY INC.
is believed to be accurate and reliable. However, GENERALPLUS TECHNOLOGY INC. makes no warranty for any errors which may appear in this document. Contact
GENERALPLUS TECHNOLOGY INC. to obtain the latest version of device specifications before placing your order. No responsibility is assumed by GENERALPLUS
TECHNOLOGY INC. for any infringement of patent or other rights of third parties which may result from its use. In addition, GENERALPLUS products are not authorized
for use as critical components in life support devices/systems or aviation devices/systems, where a malfunction or failure of the product may reasonably be expected to
result in significant injury to the user, without the express written approval of Generalplus.




Generalplus

GPR25L642B Datasheet Preview

GPR25L642B Datasheet

CMOS Serial Flash

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GPR25L642B
Table of Contents
PAGE
1. FEATURES.................................................................................................................................................................................................. 4
1.1. GENERAL .............................................................................................................................................................................................. 4
1.2. PERFORMANCE...................................................................................................................................................................................... 4
1.3. SOFTWARE FEATURES ........................................................................................................................................................................... 4
1.4. HARDWARE FEATURES .......................................................................................................................................................................... 4
2. GENERAL DESCRIPTION .......................................................................................................................................................................... 5
3. PIN CONFIGURATIONS ............................................................................................................................................................................. 5
4. PIN DESCRIPTION...................................................................................................................................................................................... 5
5. BLOCK DIAGRAM ...................................................................................................................................................................................... 6
6. MEMORY ORGANIZATION ........................................................................................................................................................................ 7
7. DEVICE OPERATION ................................................................................................................................................................................. 8
8. DATA PROTECTION................................................................................................................................................................................... 9
9. HOLD FEATURES..................................................................................................................................................................................... 11
10. COMMAND DESCRIPTION ...................................................................................................................................................................... 12
10.1.WRITE ENABLE (WREN)...................................................................................................................................................................... 13
10.2.WRITE DISABLE (WRDI) ...................................................................................................................................................................... 13
10.3.READ STATUS REGISTER (RDSR)........................................................................................................................................................ 13
10.4.WRITE STATUS REGISTER (WRSR)...................................................................................................................................................... 14
10.5.READ DATA BYTES (READ) ................................................................................................................................................................. 14
10.6.READ DATA BYTES AT HIGHER SPEED (FAST_READ) ......................................................................................................................... 14
10.7.DUAL OUTPUT MODE (DREAD) ........................................................................................................................................................... 15
10.8.SECTOR ERASE (SE) ........................................................................................................................................................................... 15
10.9.BLOCK ERASE (BE) ............................................................................................................................................................................. 15
10.10. CHIP ERASE (CE) ........................................................................................................................................................................... 15
10.11. PAGE PROGRAM (PP) ..................................................................................................................................................................... 15
10.12. DEEP POWER-DOWN (DP) ............................................................................................................................................................... 16
10.13. RELEASE FROM DEEP POWER-DOWN (RDP), READ ELECTRONIC SIGNATURE (RES)......................................................................... 16
10.14. READ IDENTIFICATION (RDID) ......................................................................................................................................................... 16
10.15. READ ELECTRONIC MANUFACTURER ID & DEVICE ID (REMS).......................................................................................................... 16
10.16. ENTER SECURED OTP (ENSO)....................................................................................................................................................... 17
10.17. EXIT SECURED OTP (EXSO) .......................................................................................................................................................... 17
10.18. READ SECURITY REGISTER (RDSCUR)........................................................................................................................................... 17
10.19. WRITE SECURITY REGISTER (WRSCUR)......................................................................................................................................... 17
11. POWER-ON STATE................................................................................................................................................................................... 18
11.1. INITIAL DELIVERY STATE ....................................................................................................................................................................... 18
12. ELECTRICAL SPECIFICATIONS ............................................................................................................................................................. 19
12.1.ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................................. 19
12.2.CAPACITANCE TA = 25°C, F = 1.0 MHZ................................................................................................................................................ 19
12.3.TIMING ANALYSIS................................................................................................................................................................................. 23
13. OPERATING CONDITIONS ...................................................................................................................................................................... 33
13.1.AT DEVICE POWER-UP AND POWER-DOWN .......................................................................................................................................... 33
© Generalplus Technology Inc.
Proprietary & Confidential
2
Apr. 26, 2011
Version: 1.2


Part Number GPR25L642B
Description CMOS Serial Flash
Maker Generalplus
Total Page 30 Pages
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