DSF1D
Features
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Low profile space Ideal for automated placement Glass passivated chip junctions Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals ponent in accordance to Ro HS 2002/95/1 and WEEE 2002/96/EC Case: JEDEC SOD-123FL molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end Weight: 0.017gram
Mechanical Date
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Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(TA = 25 °C unless otherwise noted)
Symbol DSF1A DSF1B DSF1C DSF1D DSF1F DSF1G DSF1J UNIT Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 m S single half sinewave superimposed on rated load Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current at Rated DC blocking voltage...
