MAHE1G
Features
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- Low profile package Ideal for automated placement Glass passivated chip junctions Ultrafast reverse recovery time Low switching losses, high efficiency High forward surge capability High temperature soldering： 260℃/10 seconds at terminals ponent in accordance to Ro HS 2002/95/1 and WEEE 2002/96/EC
- Major Ratings and Characteristics Mechanical Date
- IF(AV) VRRM IFSM trr VF Tj max.
1.0 A 50 V to 1000 V 30 A 50n S, 75n S 1.0 V, 1.3 V, 1.7 V 150 °C
Case: JEDEC MSMA molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D y Laser band denotes cathode end Polarity:
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Maximum Ratings & Thermal Characteristics
(TA = 25 °C unless otherwise noted)
Items Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Thermal resistance from junction to...
